Amine for low-emission epoxy resin compositions

ABSTRACT

The use of an amine of formula (I) as a component of a hardener for epoxy resins, hardeners for epoxy resins containing the amine of formula (I), and resultant epoxy resin compositions which can particularly be used as low-emission room-temperature-curing epoxy-resin coatings with high hardness and surface quality. The amine of formula (I) is low-odour and a very successful diluent for epoxy resin compositions. It is particularly obtained by reductive alkylation from 1,2-ethylenediamine or 1,2-propylenediamine and an aldehyde or ketone.

TECHNICAL FIELD

The invention pertains to the field of amines, hardeners for epoxy resins, epoxy resin compositions, and their use, particularly as coating, covering or paint.

PRIOR ART

Epoxy resin compositions that are suitable for coating purposes are to have an extremely low viscosity so that they can be processed effectively at ambient temperature. They are also to cure very rapidly and without disruption, even under humid and cold conditions, while forming an even surface without hazing, speckling or craters. Lastly, a fully cured coating is to possess high hardness with low brittleness, in order to withstand mechanical stressing as effectively as possible. For optically demanding applications, such as top coverings on floors, for example, a coating, moreover, is to exhibit high gloss and as little as possible a tendency toward yellowing under the effect of light. Prior-art hardeners for epoxy resin coatings typically comprise adducts of polyamines with epoxides, more particularly with liquid bisphenol resins. Such adducts do permit rapid curing, but are of very high viscosity, this being the reason that in order to formulate a manageable viscosity, the hardeners customarily include in addition considerable proportions of unadducted polyamines and/or diluents. The unadducted polyamines typically have an intense odor and are a cause of increased incidence of blushing effects. “Blushing” refers to surface deficiencies which appear in the course of curing, such as hazing, speckles, roughness or stickiness, and are caused by formation of salts between amines and carbon dioxide (CO₂) from the air, and occur particularly at high atmospheric humidity and low temperatures. Diluents typically lessen blushing effects and enhance surface quality and coating brittleness. As they are not incorporated into the resin matrix on curing, they may be released into the surroundings by processes of evaporation or diffusion. Nowadays, however, the desire is increasingly for low-emission products which have a low content of releasable substances after curing. For low-emission epoxy resin compositions, therefore, diluents, such as benzyl alcohol, for example, can be used only in small quantities or not at all. US 2014/0107313 and EP 2 752 403 disclose amines which are effective diluents of epoxy resin compositions and have hardly any tendency toward blushing effects. As far as curing rate and/or yellowing of the resultant epoxy resin compositions are concerned, however, these amines are still capable of being improved.

SUMMARY OF THE INVENTION

It is an object of the present invention, therefore, to provide a low-odor amine for use in hardeners of room temperature-curing epoxy resin compositions, this amine exerting a strongly diluting effect and allowing access to low-emission epoxy resin coatings having good processing qualities, these coatings curing with sufficient rapidity even under cold conditions and producing coatings of high hardness, good surface quality and low yellowing tendency.

This object is achieved with the amine of the formula (I) as described in claim 1. The amine of the formula (I) is low in odor and exerts a surprisingly highly diluting effect on the epoxy resins that are customarily used, without triggering blushing effects or incompatibilities. It allows access to low-emission epoxy resin coatings having excellent processing qualities, which cure quickly, even at low temperatures, while possessing a high ultimate hardness and a glossy, even, nonsticky surface without hazing, speckling or craters, this surface exhibiting virtually no yellowing under the influence of light.

The amine of the formula (I) can be used in particular as a constituent of hardeners which would otherwise, without the use of diluents, be too high in viscosity for coating applications. The amine of the formula (I) can be used with particular advantage together with further amines, more particularly together with amine-functional adducts of polyamines and epoxides. Such hardeners are surprisingly of low viscosity and cure surprisingly rapidly.

Further aspects of the invention are subjects of the further independent claims. Particularly preferred embodiments of the invention are subjects of the dependent claims.

EMBODIMENTS OF THE INVENTION

A subject of the invention is the use of an amine of the formula (I),

-   -   where     -   X is 1,2-ethylene or 1,2-propylene,     -   R is a hydrogen radical or is a hydrocarbon radical having 1 to         6 carbon atoms,     -   A is a five-, six- or seven-membered cycloalkyl radical having 4         to 7 carbon atoms and in the ring optionally containing an         oxygen, sulfur or nitrogen atom,     -   Y is identical or different radicals selected from the group         consisting of alkyl, alkoxy and dialkylamino having 1 to 18         carbon atoms, and n is 0 or 1 or 2 or 3,

as constituent of a hardener for epoxy resins.

Substance names beginning with “poly”, such as polyamine, polyol or polyepoxide, denote substances which formally contain per molecule two or more of the functional groups that occur in their name.

A “primary amino group” is an NH₂ group which is bonded to an organic radical, and a “secondary amino group” is an NH group which is bonded to two organic radicals, which may also together be part of a ring.

The “amine hydrogen” refers to the hydrogen atoms of primary and secondary amino groups.

“Amine hydrogen equivalent weight” is the weight of an amine or of an amine-containing composition comprising one molar equivalent of amine hydrogen. A “diluent” is a substance which is soluble in an epoxy resin and lowers its viscosity and which is not incorporated covalently into the resin matrix when the epoxy resin is cured.

The term “viscosity” in the present document refers to the dynamic viscosity or shear viscosity, which is defined by the ratio between the shearing stress and the shear rate (rate gradient) and is determined as described in the working examples.

“Molecular weight” is understood in the present document to be the molar mass (in grams per mole) of a molecule. “Average molecular weight” is the numerical average M_(n) of an oligomeric or polymeric mixture of molecules, and is determined customarily by means of gel permeation chromatography (GPC) against polystyrene as standard.

“Room temperature” refers to a temperature of 23° C.

X is preferably 1,2-propylene. These amines of the formula (I) are particularly compatible with customary epoxy resins and enable epoxy resin coatings featuring particularly high hardness, attractive surfaces, and particularly low yellowing.

R is preferably a hydrogen radical or is methyl or phenyl. These amines of the formula (I) are accessible with particular simplicity.

More preferably R is a hydrogen radical or is methyl, more particularly a hydrogen radical. These amines of the formula (I) are accessible with particular simplicity and allow access to particularly low-viscosity resins and epoxy resin compositions.

A is preferably a five- or six-membered cycloalkyl radical having 4 to 6 carbon atoms which in the ring optionally contains an oxygen atom.

More preferably A is cyclohexyl or cyclopentyl, more particularly cyclohexyl. These amines of the formula (I) are accessible with particular simplicity and are particularly compatible with customary epoxy resins, and enable epoxy resin coatings featuring rapid curing and particularly attractive surfaces.

Preferably Y is identical or different radicals selected from the group consisting of alkyl, alkoxy and dialkylamino having in each case 1 to 12, more particularly 1 to 4, carbon atoms. More preferably Y is methyl or is methoxy or is dimethylamino. Very preferably Y is methoxy or is dimethylamino, more particularly methoxy.

The radical Y is preferably in meta and/or para position. In the case of n=1, the radical Y is more particularly in para position.

n is preferably 0 or 1 or 2, more preferably 0 or 1, in particular 0. These amines allow access to particularly low-viscosity resins and epoxy resin compositions.

Particularly preferred is an amine of the formula (I) wherein R is a hydrogen radical, A is cyclohexyl and n is 0. These amines of the formula (I) are particularly readily accessible, particularly cost-effective and have particularly low viscosity. They allow access to low-odor and low-emission epoxy resin compositions of particularly low viscosity and rapid development of hardness or curing, which exhibit hardly any blushing-related surface defects even under damp and cold conditions and which exhibit virtually no yellowing.

Preferred amines of the formula (I) are selected from the group consisting of N-cyclopentylmethyl-1,2-ethanediamine, N-cyclohexylmethyl-1,2-ethanediamine, N-(2-tetrahydrofuryl)methyl-1,2-ethanediamine, N-(3-tetrahydrofuryl)-methyl-1,2-ethanediamine, N¹-cyclopentylmethyl-1,2-propanediamine and N²-cyclopentylmethyl-1,2-propanediamine and a mixture of these isomers, N¹-cyclohexylmethyl-1,2-propanediamine and N²-cyclohexylmethyl-1,2-propanediamine and a mixture of these isomers, N¹-(2-tetrahydrofuryl)methyl-1,2-propanediamine and N²-(2-tetrahydrofuryl)methyl-1,2-propanediamine and a mixture of these isomers, and N¹-(3-tetrahydrofuryl)methyl-1,2-propanediamine and N²-(3-tetrahydrofuryl)methyl-1,2-propanediamine and a mixture of these isomers.

Preferred of these are N-cyclohexylmethyl-1,2-ethanediamine and N¹-cyclo-hexylmethyl-1,2-propanediamine and N²-cyclohexylmethyl-1,2-propanediamine and a mixture of these isomers.

Maximum preference is given to N¹-cyclohexylmethyl-1,2-propanediamine and N²-cyclohexylmethyl-1,2-propanediamine and a mixture of these isomers.

The preferred amines of the formula (I) are notable for particularly ready accessibility, low viscosity, and good properties in their use in accordance with the invention.

The amine of the formula (I) is preferably obtained from the single alkylation of 1,2-ethylenediamine or 1,2-propylenediamine with a suitable alkylating agent, as for example an organic halide or a carbonyl compound.

The amine of the formula (I) is prepared preferably by reductive alkylation of 1,2-ethylenediamine or 1,2-propylenediamine with an aldehyde or ketone of the formula (II) and hydrogen,

where G either is A or is an unsaturated radical which can be hydrogenated to A, and R, A, Y and n have the definitions already stated. This preparation proceeds with particular selectivity and leads to reaction products of particularly high purity, i.e. high content of amines of the formula (I).

Preferably G is A.

Where G is an unsaturated radical which can be hydrogenated to A, benzyl for example, the reductive alkylation is carried out such that G is hydrogenated to A.

The amine of the formula (I) is therefore used preferably in the form of a reaction product of the reductive alkylation of 1,2-ethylenediamine or 1,2-propylenediamine with at least one aldehyde or ketone of the formula (II) and hydrogen.

A reaction product of this kind is particularly pure, meaning that it contains a high content of amine of the formula (I), even without elaborate steps of purification. Consequently it has a particularly low viscosity and a particular reactivity and is therefore particularly suitable as a constituent of the epoxy resin composition described.

Suitability as aldehyde of the formula (II) is possessed in particular by cyclopentanecarbaldehyde, methylcyclopentanecarbaldehyde, cyclohexanecarbaldehyde, methylcyclohexanecarbaldehyde, butylcyclohexanecarbaldehyde, dimethylcyclohexanecarbaldehyde, methoxycyclohexane-carbaldehyde, 2-tetrahydrofurancarbaldehyde, 3-tetrahydrofurancarbaldehyde, 2-tetrahydropyrancarbaldehyde, 3-tetrahydropyrancarbaldehyde, 4-tetrahydropyrancarbaldehyde, 2-tetrahydrothiophenecarbaldehyde, 3-tetrahydrothiophenecarbaldehyde, 2-pyrrolidinecarbaldehyde, 3-pyrrolidinecarbaldehyde, N-methyl-2-pyrrolidinecarbaldehyde, N-methyl-3-pyrrolidinecarbaldehyde, 2-piperidinecarbaldehyde, 3-piperidinecarbaldehyde, 4-piperidinecarbaldehyde, N-methyl-2-piperidinecarbaldehyde, N-methyl-3-piperidinecarbaldehyde or N-methyl-4-piperidinecarbaldehyde, benzaldehyde, 2-methylbenzaldehyde (o-tolualdehyde), 3-methylbenzaldehyde (m-tolualdehyde), 4-methylbenzaldehyde (p-tolualdehyde), 2,5-dimethylbenzaldehyde, 4-ethyl-benzaldehyde, 4-isopropylbenzaldehyde (cuminaldehyde), 4-tert-butyl-benzaldehyde, 2-methoxybenzaldehyde (o-anisaldehyde), 3-methoxy-benzaldehyd (m-anisaldehyde), 4-methoxybenzaldehyde (anisaldehyde), 2,3-dimethoxybenzaldehyde, 2,4-dimethoxybenzaldehyde, 2,5-dimethoxybenzaldehyde, 3,4-dimethoxybenzaldehyde (veratraldehyd), 3,5-dimethoxybenzaldehyde, 2,4,6-trimethylbenzaldehyde, 2,4,5-trimethoxybenzaldehyde (asaronaldehyde), 2,4,6-trimethoxybenzaldehyde, 3,4,5-trimethoxybenzaldehyde or 4-dimethylaminobenzaldehyde.

Preferred among these are the cycloaliphatic aldehydes, especially cyclopentanecarbaldehyde or cyclohexanecarbaldehyde.

Suitability as ketone of the formula (II) is possessed in particular by 1-cyclo-pentylethan-1-one, 1-cyclopentylpropan-1-one, 1-(2-tetrahydrofuryl)ethan-1-one, 1-(3-tetrahydrofuryl)ethan-1-one, 1-cyclohexylethan-1-one, 1-(tetrahydro-2H-pyran-4-yl)ethanone, acetophenone, benzophenone, 2′-methylacetophenone, 3′-methylacetophenone, 4′-methylacetophenone, 2′-methoxyacetophenone, 3′-methoxyacetophenone, 4′-methoxyacetophenone, 2′,4′-dimethylacetophenone, 2′,5′-dimethylacetophenone, 3′,4′-dimethylacetophenone, 3′,5′-dimethylacetophenone, 2′,4′-dimethoxyacetophenone, 2′,5′-dimethoxyacetophenone, 3′,4′-dimethoxyacetophenone, 3′,5′-dimethoxyacetophenone, 2′,4′,6′-trimethylacetophenone or 2′,4′,6′-trimethoxyacetophenone.

Preferred among these are the aliphatic ketones, especially 1-cyclopentyl-ethan-1-one or 1-cyclohexylethan-1-one.

Particularly preferred as aldehyde or ketone of the formula (II) is cyclopentanecarbaldehyde or cyclohexanecarbaldehyde.

Maximum preference is given to cyclohexanecarbaldehyde.

The reductive alkylation may take place directly with molecular hydrogen or indirectly by hydrogen transfer from other reagents, such as formic acid, for example. With preference, molecular hydrogen is used. Here, the conditions are advantageously selected such that in each case mainly one primary amino group of 1,2-ethylenediamine or 1,2-propylenediamine is singularly alkylated with high selectivity.

When the aldehyde or ketone of the formula (II) has an aromatic radical G, the reaction conditions during reductive alkylation are selected such that the aromatic ring is hydrogenated in this case.

The reaction is carried out preferably at a temperature of 40 to 120° C. and in the presence of a suitable catalyst. Preferred as catalyst are palladium on carbon (Pd/C), platinum on carbon (Pt/C), Adams catalyst or Raney nickel, more particularly palladium on carbon or Raney nickel.

When using molecular hydrogen, operation takes place preferably in a pressurized apparatus under a hydrogen pressure of 5 to 250 bar, more particularly 10 to 150 bar.

The reaction product of the reductive alkylation described may comprise not only at least one amine of the formula (I) but also further amines as byproducts. Occurring primarily as byproduct is multiply alkylated 1,2-ethylenediamine or 1,2-propylenediamine, more particularly an N,N′-dialkylated or N,N-dialkylated product, as shown in the formulae below. The presence of such byproducts raises the viscosity and lowers the reactivity of the reaction product. The reaction is therefore preferably conducted so that the formation of byproducts is suppressed as far as possible.

The reductive alkylation is carried out preferably with a stoichiometric excess of 1,2-ethylenediamine or 1,2-propylenediamine over the carbonyl groups of the aldehyde or ketone of the formula (II). The ratio between the number of 1,2-ethylenediamine or 1,2-propylenediamine molecules and the number of carbonyl groups is preferably at least 2/1, more particularly at least 3/1, very preferably at least 4/1. Excess 1,2-ethylenediamine or 1,2-propylenediamine is removed before or, preferably, after the reduction, in particular by distillation, as for example by means of thin-film, short-path or falling-stream methods. In this way the formation of more highly alkylated products is suppressed, thus giving a particularly low-viscosity and reactive reaction product.

The amine of the formula (I) is thus used preferably in the form of a reaction product from the reductive alkylation of 1,2-ethylenediamine or 1,2-propylenediamine with at least one aldehyde or ketone of the formula (II) and hydrogen, where 1,2-ethylenediamine or 1,2-propylenediamine is used in a stoichiometric excess over the carbonyl groups of the aldehyde or ketone of the formula (II) and where the excess is removed by distillation after the reduction.

The reaction product is preferably largely free of 1,2-ethylenediamine and/or 1,2-propylenediamine. It contains in particular less than 1 weight %, preferably less than 0.5 weight %, more preferably less than 0.1 weight %, of 1,2-ethylenediamine or 1,2-propylenediamine.

With particular preference the reaction product is purified by distillation. In that case the reaction product is distilled and the distillate obtained is used. A reaction product of this kind purified by distillation allows access to an epoxy resin composition featuring particularly rapid curing.

Especially preferred is distillation-purified N-cyclohexyl-1,2-ethanediamine from the reductive alkylation of 1,2-ethylenediamine with cyclohexanecarbaldehyde, where 1,2-ethylenediamine has in particular been used in a stoichiometric excess over benzaldehyde or, in particular, cyclohexanecarbaldehyde.

Also especially preferred is distillation-purified N¹— or N²-cyclohexyl-1,2-propanediamine or a mixture of these isomers, where 1,2-propylenediamine has been used in particular in a stoichiometric excess over benzaldehyde or, in particular, cyclohexanecarbaldehyde.

In a hardener for epoxy resins, the amine of the formula (I) is used preferably in combination with further amines and/or accelerators.

A further subject of the invention is thus a hardener for epoxy resins, comprising at least one amine of the formula (I) and at least one further amine, which does not correspond to the formula (I), and/or at least one accelerator. The further amine in this case is in particular not 1,2-ethylenediamine, not 1,2-propylenediamine, and not a multiply alkylated byproduct from the preparation of the amine of the formula (I).

Depending on the further amine used, a hardener of this kind may have a particularly high reactivity or a particularly high ultimate hardness or a relatively high amine equivalent weight.

Suitable accelerators are substances which accelerate the reaction between amino groups and epoxide groups, more particularly acids or compounds which can be hydrolyzed to acids, more particularly organic carboxylic acids such as acetic acid, benzoic acid, salicylic acid, 2-nitrobenzoic acid, lactic acid, organic sulfonic acids such as methanesulfonic acid, p-toluenesulfonic acid or 4-dodecylbenzenesulfonic acid, sulfonic esters, other organic or inorganic acids such as, in particular, phosphoric acid, or mixtures of the aforementioned acids and acid esters; tertiary amines such as, in particular, 1,4-di-azabicyclo[2.2.2]octane, benzyldimethylamine, α-methylbenzyldimethylamine, triethanolamine, dimethylaminopropylamine, imidazoles such as, in particular, N-methylimidazole, N-vinylimidazole or 1,2-dimethylimidazole, salts of such tertiary amines, quaternary ammonium salts, such as, in particular benzyltrimethylammonium chloride, amidines such as, in particular, 1,8-diazabicyclo[5.4.0]undec-7-ene, guanidines such as, in particular, 1,1,3,3-tetramethylguanidine, phenols, especially bisphenols, phenolic resins or Mannich bases such as, in particular, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol or polymers of phenol, formaldehyde and N,N-dimethyl-1,3-propanediamine, phosphites such as, in particular, diphenyl or triphenyl phosphites, or compounds containing mercapto groups. Preferred accelerators are acids, tertiary amines or Mannich bases.

Most preferred is salicylic acid or 2,4,6-tris(dimethylaminomethyl)phenol or a combination thereof.

Especially suitable as further amine are polyamines which have at least two, more particularly at least three, amine hydrogens, more particularly the following polyamines:

-   -   aliphatic, cycloaliphatic or arylaliphatic primary diamines,         especially 2,2-dimethyl-1,3-propanediamine, 1,3-pentanediamine         (DAMP), 1,5-pentanediamine, 1,5-diamino-2-methylpentane (MPMD),         2-butyl-2-ethyl-1,5-pentanediamine (C11-neodiamine),         1,6-hexanediamine, 2,5-dimethyl-1,6-hexanediamine,         2,2(4),4-trimethylhexamethylenediamine (TMD),         1,7-heptanediamine, 1,8-octanediamine, 1,9-nonanediamine,         1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine,         1,2-, 1,3- or 1,4-diaminocyclohexane,         bis(4-aminocyclohexyl)methane (H₁₂-MDA),         bis(4-amino-3-methylcyclohexyl)methane,         bis(4-amino-3-ethylcyclohexyl)methane,         bis(4-amino-3,5-dimethylcyclohexyl)methane,         bis(4-amino-3-ethyl-5-methyl-cyclohexyl)methane,         1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane         (isophoronediamine or IPDA), 2- or         4-methyl-1,3-diaminocyclohexane or mixtures thereof,         1,3-bis(aminomethyl)cyclohexane,         1,4-bis(aminomethyl)-cyclohexane,         2,5(2,6)-bis(aminomethyl)bicyclo[2.2.1]heptane (NBDA),         3(4),8(9)-bis(aminomethyl)tricyclo[5.2.1.0^(2,6)]decane,         1,4-diamino-2,2,6-trimethylcyclohexane (TMCDA),         1,8-menthanediamine,         3,9-bis(3-amino-propyl)-2,4,8,10-tetraoxaspiro[5.5]undecane,         1,3-bis(aminomethyl)benzene (MXDA) or         1,4-bis(aminomethyl)benzene;     -   aliphatic, cycloaliphatic or arylaliphatic primary triamines,         especially 4-aminomethyl-1,8-octanediamine,         1,3,5-tris(aminomethyl)benzene,         1,3,5-tris(aminomethyl)cyclohexane, tris(2-aminoethyl)amine,         tris(2-amino-propyl)amine or tris(3-aminopropyl)amine;     -   aliphatic or cycloaliphatic primary di- or triamines containing         ether groups, especially 4,9-dioxadodecane-1,12-diamine,         5,8-dioxadodecane-3,10-diamine,         4,7,10-trioxatridecane-1,13-diamine or higher oligomers of these         diamines,         3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5.5]undecane,         bis(3-aminopropyl)polytetrahydrofurans or other         polytetrahydrofurandiamines, cycloaliphatic ether         group-containing diamines from the propoxylation and subsequent         amination of 1,4-dimethylolcyclohexane, obtainable in particular         as Jeffamine® RFD-270 (from Huntsman), or polyoxyalkylenedi- or         -triamines, which typically represent products from the         amination of polyoxyalkylenedi- or -triols and are obtainable,         for example, under the name Jeffamine® (from Huntsman), under         the name Polyetheramine (from BASF) or under the name PC Amine®         (from Nitroil). Especially suitable         polyoxyalkylenedi-or-triamines are Jeffamine® D-230, Jeffamine®         D-400, Jeffamine® EDR-104, Jeffamine® EDR-148, Jeffamine®         EDR-176 or Jeffamine® T-403, or corresponding amines from BASF         or Nitroil;     -   polyamines containing secondary amino groups having two primary         aliphatic amino groups, such as, in particular,         3-(2-aminoethyl)aminopropylamine, bis(hexamethylene)triamine         (BHMT), diethylenetriamine (DETA), triethylenetetramine (TETA),         tetraethylenepentamine (TEPA), pentaethylenehexamine (PEHA) or         higher homologs of linear polyethyleneamines such as         polyethylenepolyamine having 5 to 7 ethyleneamine units         (referred to as “higher ethylenepolyamine”, HEPA), products from         the multiple cyanoethylation or cyanobutylation and subsequent         hydrogenation of primary di- and polyamines having at least two         primary amino groups, such as dipropylenetriamine (DPTA),         N-(2-aminoethyl)-1,3-propanediamine (N3-amine),         N,N′-bis(3-aminopropyl)ethylenediamine (N4-amine),         N,N′-bis(3-aminopropyl)-1,4-diaminobutane,         N5-(3-aminopropyl)-2-methyl-1,5-pentanediamine,         N3-(3-aminopentyl)-1,3-pentanediamine,         N5-(3-amino-1-ethylpropyl)-2-methyl-1,5-pentanediamine or         N,N′-bis(3-amino-1-ethylpropyl)-2-methyl-1,5-pentanediamine;     -   polyamines having one or two secondary amino groups, especially         products from the reductive alkylation of primary aliphatic         polyamines with monofunctional aldehydes or ketones, especially         N-benzyl-1,3-bis(aminomethyl)benzene,         N,N′-dibenzyl-1,3-bis(aminomethyl)benzene,         N-2-ethylhexyl-1,3-bis(aminomethyl)benzene,         N,N′-bis(2-ethylhexyl)-1,3-bis(aminomethyl)benzene,         N-benzyl-1,2-propanediamine, N,N′-dibenzyl-1,2-propanediamine,         N-(4-methoxybenzyl)-1,2-propanediamine,         N-(4-(dimethyl-amino)benzyl)-1,2-propanediamine,         N-(1-phenylethyl)-1,2-propanediamine,         N-benzhydryl-1,2-propanediamine,         N-(1-(4′-methyl)phenylethyl)-1,2-propanediamine,         N-(1-(4′-methoxy)phenylethyl)-1,2-propanediamine,         N-benzyl-1,2-ethanediamine, N,N′-dibenzyl-1,2-ethanediamine,         N-(4-methoxybenzyl)-1,2-ethanediamine,         N-(4-(dimethylamino)benzyl)-1,2-ethanediamine, or partially         styrenized polyamines such as, for example, styrenized MXDA         (available as Gaskamine® 240 from Mitsubishi Gas Chemical);     -   aromatic polyamines, such as, in particular, m- and         p-phenylenediamine, 4,4′-, 2,4′ and/or         2,2′-diaminodiphenylmethane,         3,3′-dichloro-4,4′-diaminodiphenylmethane (MOCA), 2,4- and/or         2,6-tolylenediamine, mixtures of 3,5-dimethylthio-2,4- and         -2,6-tolylenediamine (available as Ethacure® 300 from         Albermarle), mixtures of 3,5-diethyl-2,4- and         -2,6-tolylenediamine (DETDA),         3,3′,5,5′-tetraethyl-4,4′-diaminodiphenylmethane (M-DEA),         3,3′,5,5′-tetraethyl-2,2′-dichloro-4,4′-diaminodiphenylmethane         (M-CDEA),         3,3′-diisopropyl-5,5′-dimethyl-4,4′-diaminodiphenylmethane         (M-MIPA), 3,3′,5,5′-tetraisopropyl-4,4′-diaminodiphenylmethane         (M-DIPA), 4,4′-diaminodiphenyl sulfone (DDS),         4-amino-N-(4-aminophenyl)benzenesulfonamide,         5,5′-methylenedianthranilic acid, dimethyl         5,5′-methylenedianthranilate, 1,3-propylene         bis(4-aminobenzoate), 1,4-butylene bis(4-aminobenzoate),         polytetramethylene oxide bis(4-aminobenzoate) (available as         Versalink® from Air Products), 1,2-bis(2-aminophenylthio)ethane,         2-methylpropyl 4-chloro-3,5-diaminobenzoate or tert-butyl         (4-chloro-3,5-diaminobenzoate);     -   adducts of polyamines with epoxides or epoxy resins, especially         adducts with diepoxides having a molar ratio of approximately         2/1, or adducts with monoepoxides having a molar ratio of         approximately 1/1, or reaction products of polyamines and         epichlorohydrin, more particularly that of         1,3-bis(aminomethyl)benzene, available commercially as         Gaskamine® 328 (from Mitsubishi Gas Chemical);     -   polyamidoamines, especially reaction products of a mono- or         polybasic carboxylic acid, and/or the esters or anhydrides         thereof, particularly of a dimer fatty acid, with an aliphatic,         cycloaliphatic or aromatic polyamine that is used in a         stoichiometric excess, more particularly a polyalkyleneamine         such as, for example, DETA or TETA, more particularly the         commercially available polyamidoamines Versamid® 100, 125, 140         or 150 (from Cognis), Aradur® 223, 250 or 848 (from Huntsman),         Euretek® 3607 or 530 (from Huntsman) or Beckopox® EH 651, EH         654, EH 655, EH 661 or EH 663 (from Cytec); or     -   phenalkamines, also called Mannich bases, especially reaction         products of a Mannich reaction of phenols, more particularly         cardanol, with aldehydes, more particularly formaldehyde,         especially the commercially available phenalkamines Cardolite®         NC-541, NC-557, NC-558, NC-566, Lite 2001, Lite 2002, NX-4943,         NX-5607 or NX-5608 (from Cardolite), Aradur® 3440, 3441, 3442 or         3460 (from Huntsman) or Beckopox® EH 614, EH 621, EH 624, EH 628         or EH 629 (from Cytec).

Preferred among these are adducts of polyamines with epoxides, and polyamidoamines, phenalkamines, or aliphatic primary di- or triamines containing ether groups, more particularly polyoxyalkylenedi- or -triamines having an average molecular weight in the range from 200 to 500 g/mol, more particularly Jeffamine® D-230 or Jeffamine® T-403 (both from Huntsman), or cycloaliphatic diamines containing ether groups, from the propoxylation and subsequent amination of 1,4-dimethylolcyclohexane, especially Jeffamine® RFD-270 (from Huntsman).

It can be advantageous if the hardener comprises a combination of two or more further amines.

Particularly preferred as further amine is an adduct, having at least three amine hydrogens, of at least one polyamine having 2 to 12 carbon atoms and at least one epoxide.

Such adducts are virtually odorless and allow access to inexpensive epoxy resin compositions featuring rapid curing, high hardness and attractive surface. Without effect dilution, however, their viscosity is typically too high for many coating applications.

Suitability as polyamine for such an adduct is possessed in particular by 1,2-ethylenediamine, 1,2-propylenediamine, 1,3-propylenediamine, 1,2-butanediamine, 1,3-butanediamine, 1,4-butanediamine, 2,3-butanediamine, 2-methyl-1,3-propanediamine, 2,2-dimethyl-1,3-propanediamine, 1,3-pentanediamine (DAMP), 1,5-pentanediamine, 1,5-diamino-2-methylpentane (MPMD), 1,6-hexanediamine, 2,5-dimethyl-1,6-hexanediamine, 2,2(4),4-trimethylhexamethylenediamine (TMD), 1,7-heptanediamine, 1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane (isophoronediamine or IPDA), 1,2-diaminocyclohexane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, 2- or 4-methyl-1,3-diaminocyclohexane or mixtures thereof, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 2,5(2,6)-bis(aminomethyl)bicyclo[2.2.1]heptane (NBDA), 1,4-diamino-2,2,6-trimethylcyclohexane (TMCDA), 1,8-menthanediamine, 1,3-bis(aminomethyl)benzene (MXDA), 1,4-bis(aminomethyl)benzene, bis(2-aminoethyl) ether, 3,6-dioxaoctane-1,8-diamine, 4,7-dioxadecane-1,10-diamine, 4,7-dioxadecane-2,9-diamine, 3-(2-aminoethyl)aminopropylamine, bis(hexamethylene)triamine (BHMT), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), pentaethylenehexamine (PEHA), dipropylenetriamine (DPTA), N-(2-aminoethyl)-1,3-propanediamine (N3 amine), N,N′-bis(3-aminopropyl)ethylenediamine (N4 amine), N,N′-bis(3-aminopropyl)-1,4-diaminobutane, N5-(3-aminopropyl)-2-methyl-1,5-pentanediamine or N3-(3-aminopentyl)-1,3-pentanediamine.

Preferred among these is 1,2-ethylenediamine, 1,2-propylenediamine, 1,3-propylenediamine, 1,2-butanediamine, 1,3-butanediamine, 1,4-butanediamine, DAMP, MPMD, TMD, IPDA, 2- or 4-methyl-1,3-diaminocyclohexane or mixtures thereof, 1,3-bis(aminomethyl)cyclohexane, MXDA, DETA, TETA, DPTA, N3 amine, or N4 amine.

These amines are readily accessible and inexpensive. In an epoxy resin composition, in unadducted form, however, they may give rise to problems with odor and emissions and, on curing, to problems with blushing effects. The adduct present in the hardener preferably contains only a low level of such polyamines in unadducted form.

Particularly preferred among these is 1,2-ethylenediamine, 1,2-propylenediamine or MPMD. These amines are accessible with simplicity and, after adducting, can be removed in a simple way from the adduct, by distillation, if they have been used in excess for the adducting. The adducts obtained with them allow access to epoxy resin compositions featuring rapid curing, high hardness and attractive surfaces. Without suitable dilution, however, the viscosity is usually too high for epoxy resin coatings.

Preferred as epoxide for such an adduct are monoepoxides, in particular, aromatic monoepoxides, especially cresyl glycidyl ether, tert-butylphenyl glycidyl ether or the glycidyl ether of cardanol. Particularly preferred is cresyl glycidyl ether. Suitable cresyl glycidyl ethers are all isomeric cresyl glycidyl ethers or mixtures thereof, more particularly commercially available types such as, in particular, Araldite® DY-K (from Huntsman), Polypox™ R6 (from Dow), Heloxy™ KR (from Hexion) or Erisys® GE-10 (from CVC Spec. Chem.).

Also preferred as epoxide for such an adduct are diepoxides, especially aromatic diepoxides, more particularly bisphenol A or bisphenol F or bisphenol A/F diglycidyl ethers or resorcinol diglycidyl ether, especially commercially available liquid resins.

The adduct is prepared preferably by slow metered addition of the epoxide to an initial charge of polyamine, the temperature of the reactants being maintained preferably in the range from 40 to 120° C., more particularly 50 to 110° C.

Such adducts exhibit excellent properties as hardeners for epoxy resins, more particularly a rapid cure rate even at low temperatures and a relatively unpronounced tendency toward blushing effects. They produce films of excellent quality, but in view of their viscosity are suitable for coating applications only if they are diluted.

Through the combination with the amine of the formula (I), a hardener is formed which allows access to low-emission epoxy resin coatings featuring excellent processing properties, rapid curing, attractive surface, and low tendency toward yellowing.

Particular preference is given to an adduct having at least three amine hydrogens of at least one polyamine, with at least one aromatic monoepoxide, these being reacted in a molar ratio of approximately 1/1. During the reaction, the polyamine has been present in excess and has been removed by distillation after the reaction.

For an adduct of this kind, the aromatic monoepoxide is preferably a cresyl glycidyl ether, in particular ortho-cresyl glycidyl ether.

For an adduct of this kind, the polyamine is preferably 1,2-ethylenediamine, 1,2-propylenediamine, 1,3-propylenediamine or MPMD, particularly preferably 1,2-propylenediamine or MPMD.

More particularly preferred is an adduct of 1,2-propylenediamine with o-cresyl glycidyl ether that is prepared with an excess of 1,2-propylenediamine and with subsequent removal of the excess by distillation. An adduct of this kind contains a high content of 1-((2-aminopropyl)amino)-3-(2-methylphenoxy)propan-2-ol.

Further more particularly preferred is an adduct of 1,5-diamino-2-methylpentane with o-cresyl glycidyl ether that has been prepared with an excess of 1,5-diamino-2-methylpentane, with subsequent removal of the excess by distillation. An adduct of this kind contains a high content of 1-((5-amino-2(4)-methylpentyl)amino-3-(2-methylphenoxy)propan-2-ol.

The term “excess” in this case relates not to the reactive groups but rather to the molar ratio between the polyamine molecule and the cresyl glycidyl ether.

Further particularly preferred is an adduct, having at least three amine hydrogens, of at least one polyamine and at least one aromatic diepoxide, reacted in a molar ratio of approximately 2/1. During the reaction, the polyamine has in particular been present in excess and after the reaction has been removed by distillation.

The term “excess” in this context refers not to the reactive groups, but instead to the molar ratio between the polyamine molecule and the diepoxide molecule. For an adduct of this kind, the aromatic diepoxide is preferably a bisphenol A or bisphenol F or bisphenol A/F diglycidyl ether or a resorcinol diglycidyl ether, more particularly a commercially available liquid resin.

For an adduct of this kind the polyamine is preferably 1,2-ethylenediamine, 1,2-propylenediamine, 1,3-propylenediamine or MPMD, more preferably 1,2-ethylenediamine or 1,2-propylenediamine or MPMD, more particularly 1,2-propylenediamine.

The preferred adducts are accessible with simplicity and exhibit particularly high compatibility and reactivity with the customary epoxy resin compositions, have virtually no tendency toward blushing effects, and enable fully cured films of high gloss and high hardness to be produced. Used on their own, however, they are also of too high viscosity as hardeners for epoxy resin coatings.

The hardener may further comprise at least one diluent, more particularly xylene, 2-methoxyethanol, dimethoxyethanol, 2-ethoxyethanol, 2-propoxy-ethanol, 2-isopropoxyethanol, 2-butoxyethanol, 2-phenoxyethanol, 2-benzyl-oxyethanol, benzyl alcohol, ethylene glycol, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol diphenyl ether, diethylene glycol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol di-n-butylyl ether, propylene glycol butyl ether, propylene glycol phenyl ether, dipropylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol dimethyl ether, dipropylene glycol di-n-butyl ether, N-methylpyrrolidone, diphenylmethane, diisopropylnaphthalene, petroleum fractions such as, for example, Solvesso® grades (from Exxon), alkylphenols such as tert-butylphenol, nonylphenol, dodecylphenol and Cardanol (from cashew shell oil, containing, as the main constituent, 3-(8,11,14-pentadecatrienyl)phenol available for example as Cardolite NC-700 from Cardolite Corp., USA), styrenized phenol, bisphenols, aromatic hydrocarbon resins, especially those containing phenol groups, alkoxylated phenol, especially ethoxylated or propoxylated phenol, more particularly 2-phenoxyethanol, adipates, sebacates, phthalates, benzoates, organic phosphoric acid esters or sulfonic acid esters or sulfonamides. Preferred are benzyl alcohol, dodecylphenol, tert-butylphenol, styrenized phenol, ethoxylated phenol, or aromatic hydrocarbon resins containing phenol groups, more particularly the Novares® grades LS 500, LX 200, LA 300 or LA 700 (from Rutgers).

The hardener component preferably contains none or only a low level of diluents. With preference the hardener contains not more than 5 weight % of diluents.

The hardener may comprise further substances that are reactive toward epoxide groups, examples being monoamines such as hexylamine or benzylamine, or compounds containing mercapto groups, more particularly the following:

-   -   liquid, mercaptan-terminated polysulfide polymers, known under         the brand name Thiokol® (from Morton Thiokol; available for         example from SPI Supplies, or from Toray Fine Chemicals), more         particularly types LP-3, LP-33, LP-980, LP-23, LP-55, LP-56,         LP-12, LP-31, LP-32 or LP-2; and also, moreover, under the brand         name Thioplast® (from Akzo Nobel), more particularly the types G         10, G 112, G 131, G 1, G 12, G 21, G 22, G 44 or G 4;     -   mercaptan-terminated polyoxyalkylene ethers, available for         example by reaction of polyoxyalkylenediols or -triols either         with epichlorohydrin or with an alkylene oxide, followed by         sodium hydrogensulfide;     -   mercaptan-terminated compounds in the form of polyoxyalkylene         derivatives known under the brand name Capcure® (from Cognis),         especially types WR-8, LOF or 3-800;     -   polyesters of thiocarboxylic acids, for example pentaerythritol         tetramercap-toacetate, trimethylolpropane trimercaptoacetate,         glycol dimercaptoacetate, pentaerythritol         tetra(3-mercaptopropionate), trimethylolpropane         tri(3-mercaptopropionate) or glycol di-(3-mercaptopropionate),         or products of esterification of polyoxyalkylenediols or-triols,         of ethoxylated trimethylolpropane or of polyester diols with         thiocarboxylic acids such as thioglycolic acid or 2- or         3-mercaptopropionic acid; or     -   further compounds containing mercapto groups, such as, in         particular, 2,4,6-trimercapto-1,3,5-triazine,         2,2′-(ethylenedioxy)diethanethiol (triethylene glycol         dimercaptan) or ethanedithiol.

The hardener is preferably largely free from amines having a molecular weight below 150 g/mol, more particularly below 120 g/mol. It contains preferably less than 2 weight %, more particularly less than 1 weight %, of amines having a molecular weight below 120 g/mol, more particularly below 150 g/mol. A hardener of this kind has particularly toxicological and odor advantages and enables access to coatings having particularly attractive surfaces.

The hardener of the invention comprises, based on the reactive constituents, preferably 1 to 90 weight %, preferably 2 to 80 weight %, more preferably 5 to 65 weight %, more particularly 10 to 50 weight %, of amine of the formula (I). Hardeners of this kind are notable for low viscosity and allow access to epoxy resin coatings having high cure rate, hardly any tendency toward blushing effects, and high hardness.

A particularly preferred hardener comprises

-   -   at least one amine of the formula (I),     -   at least one adduct, which more particularly is either an adduct         of at least one polyamine and at least one aromatic monoepoxide,         reacted approximately in a molar ratio of 1/1, or an adduct of         at least one polyamine and at least one aromatic diepoxide,         reacted approximately in a molar ratio of 2/1, and     -   optionally at least one further amine, not of the formula (I),         and/or at least one accelerator.

The amine of the formula (I), the adduct and the further amine here are present in particular in an amount such that of the amine hydrogens present overall in the hardener,

-   -   10% to 80% come from amines of the formula (I),     -   20% to 80% from adducts, and     -   0% to 40% from further amines.

A hardener of this kind has a low viscosity and cures particularly rapidly and largely without blushing effects to form cured films of high gloss and high hardness which exhibit virtually no yellowing.

A further subject of the invention is an epoxy resin composition comprising

-   -   a resin component comprising at least one epoxy resin and     -   a hardener component comprising at least one amine of the         formula (I) as described above.

The hardener component preferably comprises a hardener comprising at least one amine of the formula (I) and at least one further amine and/or at least one accelerator, as described above.

Suitability as epoxy resin is possessed by customary technical epoxy resins. These are obtained in a known manner, as for example from the oxidation of the corresponding olefins or from the reaction of epichlorohydrin with the corresponding polyols, polyphenols or amines.

Particularly suitable as epoxy resin are what are called liquid polyepoxy resins, referred to hereinafter as “liquid resin”. These have a glass transition temperature below 25° C.

Likewise possible as epoxy resin are what are called solid resins, which have a glass transition temperature above 25° C. and can be comminuted to powders which are pourable at 25° C.

Suitable epoxy resins are, in particular, aromatic epoxy resins, more particularly the glycidylization products of:

-   -   bisphenol A, bisphenol F or bisphenol A/F, where A stands for         acetone and F for formaldehyde, which served as reactants in the         preparation of these bisphenols. In the case of bisphenol F,         there may also be positional isomers present, derived more         particularly from 2,4′- or 2,2′-hydroxyphenylmethane.     -   dihydroxybenzene derivatives such as resorcinol, hydroquinone or         pyrochatechol;     -   further bisphenols or polyphenols such as         bis(4-hydroxy-3-methylphenyl)methane,         2,2-bis(4-hydroxy-3-methylphenyl)propane (bisphenol C),         bis-(3,5-dimethyl-4-hydroxyphenyl)methane,         2,2-bis(3,5-dimethyl-4-hydroxyphenyl)propane,         2,2-bis(3,5-dibromo-4-hydroxyphenyl)propane,         2,2-bis(4-hydroxy-3-tert-butylphenyl)propane,         2,2-bis(4-hydroxyphenyl)butane (bisphenol B),         3,3-bis(4-hydroxyphenyl)pentane, 3,4-bis(4-hydroxyphenyl)hexane,         4,4-bis(4-hydroxyphenyl)heptane,         2,4-bis(4-hydroxyphenyl)-2-methylbutane,         2,4-bis(3,5-dimethyl-4-hydroxyphenyl)-2-methylbutane,         1,1-bis(4-hydroxyphenyl)cyclohexane (bisphenol Z),         1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane         (bisphenol-TMC), 1,1-bis(4-hydroxyphenyl)-1-phenylethane,         1,4-bis[2-(4-hydroxyphenyl)-2-propyl]benzene (bisphenol P),         1,3-bis[2-(4-hydroxyphenyl)-2-propyl]benzene (bisphenol M),         4,4′-dihydroxybiphenyl (DOD), 4,4′-dihydroxybenzophenone,         bis(2-hydroxynaphth-1-yl)methane,         bis(4-hydroxynaphth-1-yl)methane, 1,5-dihydroxynaphthalene,         tris(4-hydroxyphenyl)methane,         1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, bis(4-hydroxyphenyl)         ether or bis(4-hydroxyphenyl) sulfone;     -   condensation products of phenols with formaldehyde which are         obtained under acidic conditions, such as phenol novolaks or         cresol novolaks, also called bisphenol F novolaks;     -   aromatic amines, such as aniline, toluidine, 4-aminophenol,         4,4′-methylenediphenyldiamine,         4,4′-methylenediphenyldi-(N-methyl)amine,         4,4′-[1,4-phenylenebis(1-methylethylidene)]bisaniline         (bisaniline P) or         4,4′-[1,3-phenylenebis(1-methylethylidene)]bisaniline         (bisaniline M).

Further suitable epoxy resins are aliphatic or cycloaliphatic polyepoxides, more particularly

-   -   glycidyl ethers of saturated or unsaturated, branched or         unbranched, cyclic or open-chain di-, tri- or tetra-functional         C₂ to C₃₀ alcohols, especially ethylene glycol, propylene         glycol, butylene glycol, hexanediol, octanediol, polypropylene         glycols, dimethylolcyclohexane, neopentyl glycol,         dibromoneopentyl glycol, castor oil, trimethylolpropane,         trimethylolethane, pentaerythritol, sorbitol or glycerol, or         alkoxylated glycerol or alkoxylated trimethylolpropane;     -   a hydrogenated bisphenol A, F or A/F liquid resin, or the         glycidylation products of hydrogenated bisphenol A, F or A/F;     -   a N-glycidyl derivative of amides or heterocyclic nitrogen         bases, such as triglycidyl cyanurate or triglycidyl         isocyanurate, or reaction products of epichlorohydrin with         hydantoin.     -   epoxy resins from the oxidation of olefins, such as, in         particular, vinylcyclohexene, dicyclopentadiene, cyclohexadiene,         cyclododecadiene, cyclododecatriene isoprene, 1,5-hexadiene,         butadiene, polybutadiene or divinylbenzene.

A preferred epoxy resin in the resin component is a liquid resin based on a bisphenol, more particularly a diglycidyl ether of bisphenol A, bisphenol F or bisphenol A/F, of the kind available commercially, for example, from Dow, Huntsman or Momentive. These liquid resins have a low viscosity for epoxy resins and in the cured state exhibit good properties as a coating. They may include fractions of solid bisphenol A resin or bisphenol F novolaks.

The resin component may comprise are active diluent, more particularly a reactive diluent having at least one epoxide group. Particularly suitable as reactive diluents are the glycidyl ethers of mono- or polyhydric phenols or aliphatic or cycloaliphatic alcohols, such as, in particular, the aforementioned polyglycidyl ethers of di- or polyols, or, furthermore, phenyl glycidyl ether, cresyl glycidyl ether, guaiacol glycidyl ether, 4-methoxyphenyl glycidyl ether, p-n-butylphenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, 4-nonylphenyl glycidyl ether, 4-dodecylphenyl glycidyl ether, cardanol glycidyl ether, benzyl glycidyl ether, allyl glycidyl ether, butyl glycidyl ether, hexyl glycidyl ether, 2-ethylhexyl glycidyl ether, or glycidyl ethers of natural alcohols such as, in particular, C₈ to C₁₀ alkyl glycidyl ether or C₁₂ to C₁₄ alkyl glycidyl ether. The addition of a reactive diluent to the epoxy resin has the effect of reducing the viscosity, and/or of reducing the glass transition temperature and/or the mechanical values.

The epoxy resin composition optionally comprises further constituents, particularly auxiliaries and adjuvants customarily used in epoxy resin compositions, examples being the following:

-   -   solvents, diluents, film-forming assistants or extenders, such         as especially the aforementioned diluents;     -   reactive diluents, especially reactive diluents containing         epoxide groups, as mentioned above, epoxidized soybean oil or         linseed oil, compounds containing acetoacetate groups,         especially acetoacetylated polyols, butyrolactone, carbonates,         aldehydes, and also, moreover, isocyanates or silicones         containing reactive groups;     -   polymers, especially polyamides, polysulfides, polyvinylformal         (PVF), polyvinylbutyral (PVB), polyurethanes (PU), polymers with         carboxyl groups, polyamides, butadiene-acrylonitrile copolymers,         styrene-acrylonitrile copolymers, butadiene-styrene copolymers,         homo- or copolymers of unsaturated monomers, especially from the         group encompassing ethylene, propylene, butylene, isobutylene,         isoprene, vinyl acetate or alkyl (meth)acrylates, especially         chlorosulfonated polyethylenes or fluorine-containing polymers,         sulfonamide-modified melamines or purified Montan waxes;     -   inorganic or organic fillers, especially ground or precipitated         calcium carbonates, with or without a coating of fatty acids,         more particularly of stearates, barytes (heavy spar), talcs,         finely ground quartzes, silica sand, iron mica, dolomites,         wollastonites, kaolins, mica (potassium aluminum silicate),         molecular sieves, aluminum oxides, aluminum hydroxides,         magnesium hydroxide, silicas, cements, gypsums, flyashes, carbon         black, graphite, metal powders such as aluminum, copper, iron,         zinc, silver or steel, PVC powders or hollow beads;     -   fibers, especially glass fibers, carbon fibers, metal fibers,         ceramic fibers, or polymeric fibers such as polyamide fibers or         polyethylene fibers;     -   pigments, especially titanium dioxide and/or iron oxides;     -   the aforementioned accelerators;     -   rheology modifiers, especially thickeners or antisettling         agents;     -   adhesion promoters, especially organoalkoxysilanes;     -   stabilizers against oxidation, heat, light or UV radiation;     -   flame retardants, especially aluminum hydroxide (ATH), magnesium         dihydroxide (MDH), antimony trioxide, antimony pentoxide, boric         acid (B(OH)₃), zinc borate, zinc phosphate, melamine borate,         melamine cyanurate, ammonium polyphosphate, melamine phosphate,         melamine pyrophosphate, polybrominated diphenyl oxides or         diphenyl ethers, phosphates such as especially diphenyl cresyl         phosphate, resorcinol bis(diphenyl phosphate), resorcinol         diphosphate oligomer, tetraphenylresorcinol diphosphite,         ethylenediamine diphosphate or bisphenol A bis(diphenyl         phosphate), tris(chloroethyl) phosphate, tris(chloro-propyl)         phosphate or tris(dichloroisopropyl) phosphate,         tris[3-bromo-2,2-bis-(bromomethyl)propyl]phosphate,         tetrabromobisphenol A, bis(2,3-dibromopropyl ether) of bisphenol         A, brominated epoxy resins, ethylenebis(tetra-bromophthalimide),         ethylenebis(dibromonorbornanedicarboximide),         1,2-bis(tribromophenoxy)ethane, tris(2,3-dibromopropyl)         isocyanurate, tribromophenol, hexabromocyclododecane,         bis(hexachlorocyclopentadieno)-cyclooctane or chlorinated         paraffins;     -   surface-active substances, especially wetting agents, flow         control agents, deaerating agents or defoamers;     -   biocides, such as, for example, algicides, fungicides or fungal         growth inhibitors.

The epoxy resin composition preferably comprises further auxiliaries and adjuvants, especially wetting agents, flow control agents, defoamers, stabilizers, pigments and/or accelerators, especially salicylic acid and/or 2,4,6-tris(dimethylaminomethyl)phenol.

The epoxy resin composition preferably contains none or only a small amount of diluents, preferably not more than 5 weight %, especially not more than 2 weight %.

The ratio of the number of groups that are reactive toward epoxide groups in the epoxy resin composition, to the number of epoxide groups, is preferably in the range from 0.5 to 1.5, more particularly 0.7 to 1.2.

The amine hydrogens and, where present, other groups that are reactive toward epoxide groups, present in the epoxy resin composition, react with the epoxide groups with ring-opening of the latter groups (addition reaction). As a result of these reactions, the composition undergoes polymerization and ultimately cures. The person skilled in the art is aware that primary amino groups are difunctional groups with respect to epoxide groups, and a primary amino group therefore counts as two groups that are reactive toward epoxide groups.

The two components of the epoxy resin composition are each stored in their own container. Further constituents of the epoxy resin composition may be present as part of the resin component or of the hardener component, with further constituents that are reactive toward epoxide groups preferably being part of the hardener component. A suitable container for storing the resin component or the hardener component is, in particular, a drum, a Hobbock, a pouch, a pail, a canister, a cartridge or a tube. The components are storable, meaning that they can be kept for several months up to a year or more before being employed, without suffering alteration in their respective properties to any extent relevant for their use. For the use of the epoxy resin composition, the resin component and the hardener component are mixed with one another shortly before or during application. The mixing ratio between the two components is preferably selected such that the groups of the hardener component that are reactive toward epoxide groups are present in an appropriate ratio to the epoxide groups of the resin component, as described above. In terms of parts by weight, the mixing ratio between the resin component and the hardener component is customarily in the range from 1:10 to 10:1.

The two components are mixed by means of suitable method; this may take place continuously or batchwise. If mixing takes place prior to application, it should be ensured that not too much time elapses between the mixing of the components and application, since otherwise there may be disruptions, such as retarded or incomplete development of adhesion to the substrate, for example. Mixing takes place in particular at ambient temperature, which is typically in the range from about 5 to 50° C., preferably at about 10 to 30° C. The mixing of the two components is at the same time the start of curing through chemical reaction, as described above. Curing takes place typically at a temperature in the range from 0 to 150° C. It takes place preferably at ambient temperature and typically extends over several days to weeks. The duration is dependent on factors including the temperature, the reactivity of the constituents and their stoichiometry, and also the presence of accelerators.

A further subject of the invention, accordingly, is a cured composition obtained from the curing of an epoxy resin composition as described in the present document.

The epoxy resin composition is applied to at least one substrate, those below being particularly suitable:

-   -   glass, glass-ceramic, concrete, mortar, brick, tile, plaster or         natural stones such as granite or marble;     -   metals or alloys such as aluminum, iron, steel or nonferrous         metals, or surface-enhanced metals or alloys such as galvanized         or chromed metals;     -   leather, textiles, paper, wood, woodbase materials bonded with         resins, such as phenolic, melamine or epoxy resins, for example,         resin-textile composites, or other polymer composites;     -   plastics, especially rigid or flexible PVC, ABS, polycarbonate         (PC), polyamide (PA), polyesters, PMMA, epoxy resins, PU, POM,         PO, PE, PP, EPM or EPDM, the plastics having optionally been         surface-treated by plasma, corona or flame treatment;     -   fiber-reinforced plastics, such as carbon fiber-reinforced         plastics (CRP), glass fiber-reinforced plastics (GRP) or sheet         molding compounds (SMC);     -   coated substrates, such as powder-coated metals or alloys;     -   paints or varnishes.

As and when necessary, the substrates may be pretreated before the epoxy resin composition is applied. Such pretreatments include, in particular, physical and/or chemical cleaning techniques, as for example sanding, sandblasting, shotblasting, brushing and/or blowing, and also, furthermore, treatment with cleaners or solvents, or the application of an adhesion promoter, an adhesion promoter solution or a primer.

The epoxy resin composition described can be used with advantage as a fiber composite matrix for fiber composite materials (composites) such as, in particular, CRP or GRP, or as an encapsulating compound, sealant, adhesive, covering, coating, paint, varnish, seal, priming coat or primer.

More particularly it can be used as an encapsulating compound, such as an electrical encapsulant, for example, or as an adhesive, more particularly as a bodywork adhesive, sandwich element adhesive, half-shell adhesive for rotor blades of wind turbines, bridge element adhesive or anchoring adhesive. It can also be used, in particular, as a covering, coating, paint, varnish, seal, priming coat for primer for construction and industry applications, more particularly as a floor covering or floor coating for interiors such as offices, industrial halls, sports halls or cooling rooms, or, in the exterior segment, for balconies, terraces, parking decks, bridges or roofs, as a protective coating for concrete, cement, metals, plastics or wood, for the surface sealing of wooden constructions, vehicles, loading areas, tanks, silos, shafts, piping circuits, pipelines, machines or steel constructions, for example, such as of boats, piers, offshore platforms, sluice gates, hydroelectric power stations, river constructions, swimming pools, wind turbines, bridges, chimneys, cranes or sheet-pile walls, for example.

In particular, moreover, it can be used as an undercoat, tie coat, anticorrosion primer, or for rendering surfaces hydrophobic.

The fully or partly cured epoxy resin composition, especially when used as a coating, covering or paint, may have a further coating, covering or paint applied to it, in which case this further layer may likewise comprise an epoxy resin composition, or else may comprise a different material, particularly a polyurethane coating or polyurea coating.

With particular advantage the epoxy resin composition described is used as a coating.

A further subject of the invention, accordingly, is a coating comprising an epoxy resin composition as described above.

A coating in this context refers to two-dimensionally applied coverings of all kinds, especially paints, varnishes, seals, priming coats or primers, as described above, or floor coverings or protective coatings, including in particular those for heavy-duty corrosion control.

With particular advantage the epoxy resin composition described is used in low-emission coatings that carry eco-quality seals, according for example to Emicode (EC1 Plus), AgBB, DIBt, Der Blaue Engel, AFSSET, RTS (M1), and US Green Building Council (LEED).

As a coating, the epoxy resin composition is used advantageously in a method for coating, where it has a liquid consistency with low viscosity and good leveling properties and is applied more particularly as a self-leveling or thixotrope coating to predominantly planar surfaces or as a paint. In the context of this application, the viscosity of the epoxy resin composition immediately after the mixing of the resin and hardener components, and as measured at 20° C., is preferably in the range from 300 to 4000 mPa·s, preferably in the range from 300 to 2000 mPa·s, more preferably in the range from 300 to 1500 mPa·s. Within the working time, the mixed composition is applied two-dimensionally as a thin film having a layer thickness of typically about 50 μm to about 5 mm to a substrate, typically at ambient temperature. Application is accomplished in particular by pouring the composition onto the substrate that is to be coated, and then spreading it evenly with the aid, for example, of a doctor blade or toothed applicator. Application may alternatively take place with a brush or roller or by spray application, as an anticorrosion coating on steel, for example.

Curing is typically accompanied by the development of largely clear, glossy and nonsticky films of high-hardness, which exhibit effective adhesion to a very wide variety of substrates.

The use of the epoxy resin composition results in an article comprising the cured composition from the curing of the epoxy resin composition described. The cured composition here is present in particular in the form of a coating.

The epoxy resin composition described is notable for advantageous properties. It is of low viscosity and odor and cures rapidly, even under damp and cold conditions, and does so largely without blushing effects, even when the fractions of diluents are small or none are used at all, and in particular also without the use of volatile, intensely odorous amines. In two-dimensional use as a coating, the resulting films are clear, nonsticky, very hard, and of high surface quality, with virtually no yellowing under the influence of light. Accessible in particular with the epoxy resin composition described are low-emission epoxy resin products which fulfill the conditions for numerous eco-quality seals and at the same time satisfy exacting requirements in terms of operational safety, processing properties and service properties.

A further subject of the invention is a method for the dilution of a hardener for epoxy resins and/or of an epoxy resin composition, by addition of an amine of the formula (I), as described above.

The hardener for epoxy resins or the epoxy resin composition here comprises in particular an adduct, having at least three amine hydrogens, of at least one polyamine having 2 to 12 carbon atoms and at least one epoxide, as described above.

The adduct preferably is either an adduct of at least one polyamine and at least one aromatic monoepoxide, reacted in a molar ratio of approximately 1/1, or an adduct of at least one polyamine and at least one aromatic diepoxide, reacted in a molar ratio of approximately 2/1, as described above.

Following dilution, the hardener in particular has a viscosity, measured at 20° C., in the range from 100 to 4000 mPa·s, preferably in the range from 100 to 2000 mPa·s, more preferably in the range from 100 to 1500 mPa·s.

Following dilution, and immediately after mixing with the amine of the formula (I), the epoxy resin composition has in particular a viscosity, measured at 20° C., in the range from 300 to 4000 mPa·s, preferably in the range from 300 to 2000 mPa·s, more preferably in the range from 300 to 1500 mPa·s.

EXAMPLES

Set out below are working examples which are intended to elucidate in more detail the invention described. The invention is of course not confined to these working examples described.

“ANEW” stands for the amine hydrogen equivalent weight.

“EEW” stands for the epoxide equivalent weight.

“Standard conditions” refer to a temperature of 23±1° C. and a relative atmospheric humidity of 50±5%. “SC” stands for “standard conditions”.

Description of Measurement Methods:

Infrared spectra (FT-IR) were measured as undiluted films on an FT-IR instrument 1600 from Perkin-Elmer equipped with a horizontal ATR measurement unit with ZnSe crystal; the absorption bands are reported in wavenumbers (cm⁻¹); (measuring window: 4000-650 cm⁻¹).

¹H-NMR spectra were measured on a Bruker Ascend 400 spectrometer at 400.14 MHz; the chemical shifts δ are reported in ppm relative to tetramethylsilane (TMS). No distinction is made between true and pseudo-coupling patterns.

Gas chromatograms (GC) were measured in the temperature range from 60 to 320° C. at a heating rate of 15° C./min and 10 min dwell time at 320° C. The injector temperature was 250° C. A Zebron ZB-5 column was used (L=30 m, ID=0.25 mm, dj=0.5 μm) with a gas flow rate of 1.5 ml/min. Detection took place by means of flame ionization (FID).

The viscosity of samples with relatively high viscosity (above 150 mPa·s) was measured on a thermostated cone/plate viscometer, Rheotec RC30 (cone diameter 50 mm, cone angle 1°, cone tip/plate distance 0.05 mm, shear rate 10 s⁻¹).

The viscosity of low-viscosity samples (below 150 mPa·s) was measured on a thermostated cone/plate rheometer, Anton Paar Physica MCR 300 (cone diameter 25 mm, cone angle 2°, cone tip/plate distance 0.05 mm, shear rate 100 s⁻¹).

The amine number was determined by titration (with 0.1N HClO₄ in acetic acid against crystal violet).

Substances Used:

-   -   Cyclohexane-carbaldehyde: technical, ≥90% (Sigma-Aldrich)

Tetrahydrofuran-3-carbaldehyde: solution 50% by weight in water (98%) (Sigma Aldrich)

-   -   Araldite® GY 250: bisphenol A diglycidyl ether, EEW about 187.5         g/eq (from Huntsman)     -   Araldite® DY-E: monoglycidyl ether of C₁₂ to C₁₄ alcohols, EEW         about 290 g/eq (from Huntsman)     -   EP adduct 1: reaction product of 1,2-propylenediamine and         Araldite® DY-K, as described below; AHEW about 90.0 g/eq;         viscosity (20° C.) 23 000 mPa·s     -   Araldite® DY-K: cresyl glycidyl ether, EEW about 182 g/eq (from         Huntsman)     -   Gaskamine® 240: styrenized 1,3-bis(aminomethyl)benzene; AHEW 103         g/eq; viscosity (20° C.) 165 mPa·s (from Mitsubishi Gas         Chemical)

EP adduct 1 was prepared by initially introducing 4.15 kg of 1,2-propylenediamine under a nitrogen atmosphere, heating this initial charge to 70° C. and then slowly adding 2.93 kg of Araldite® DY-K with thorough stirring, the temperature of the reaction mixture being 70 to 80° C. After 1 hour at 80° C., the reaction mixture was cooled and the volatile constituents were removed by distillation using a thin-film evaporator (0.5-1 mbar, jacket temperature 115° C.).

Preparation of Amines

Amine 1: Mixture of N¹-cyclohexyl-1,2-propanediamine and N²-cyclohexyl-1-2-propanediamine

A round-bottomed flask was charged at room temperature with 68.2 g (0.92 mol) of 1,2-propylenediamine under a nitrogen atmosphere. With thorough stirring, a solution of 25.0 g (0.23 mol) of cyclohexanecarbaldehyde in 500 ml of isopropanol was added slowly dropwise, followed by stirring for 2 hours more. Thereafter the reaction mixture was hydrogenated under a hydrogen pressure of 90 bar, at a temperature of 80° C. and with a flow rate of 5 ml/min, on a continuous hydrogenation apparatus with Pd/C fixed-bed catalyst. To monitor the reaction, IR spectroscopy was used to verify whether the imine band at about 1665 cm⁻¹ had disappeared. At that point the hydrogenated solution was concentrated on a rotary evaporator at 65° C., with unreacted 1,2-propylenediamine and isopropanol being removed. The resulting reaction mixture was a clear, slightly yellowish liquid.

28.1 g of this reaction mixture were distilled under reduced pressure at 80° C., and 12.5 g of distillate were collected at a vapor temperature of 57 to 59° C. and 0.035 bar. This gave a colorless liquid having a viscosity of 11.5 mPa·s at 20° C., an amine number of 635.1 mg KOH/g and a purity as determined by GC of >90% (retention time 8.45-8.50 min), which was used hereinafter as amine 1.

¹H-NMR (CDCl₃): 2.96-2.70 (m, 1H, CHCH₃), 2.60-2.29 (m, 4H, 2×CH₂—N), 1.82-0.84 (m, 11H, Cy-H), 1.35 (br s, 3H, NH and NH₂), 1.06 (d, 3H, CH₃).

FT-IR: 3295, 2925, 2807, 1592, 1447, 1372, 1344, 1308, 1262, 1128, 1091, 955, 842, 821, 793.

Amine 2: Mixture of N¹-(3-tetrahydrofurylmethyl)-1,2-propanediamine and N²-(3-tetrahydrofurylmethyl)-1-2-propanediamine

A round-bottomed flask was charged at room temperature with 74.1 g (1 mol) of 1,2-propylenediamine under a nitrogen atmosphere. With thorough stirring, a mixture of 50.0 g (0.25 mol) of a solution of 50 weight % of tetrahydrofuran-3-carbaldehyde in water and 500 ml of isopropanol was added slowly dropwise, followed by stirring for 2 hours more. Thereafter the reaction mixture was hydrogenated under a hydrogen pressure of 90 bar, at a temperature of 80° C. and with a flow rate of 5 ml/min, on a continuous hydrogenation apparatus with Pd/C fixed-bed catalyst. To monitor the reaction, IR spectroscopy was used to verify whether the imine band at about 1665 cm⁻¹ had disappeared. At that point the hydrogenated solution was concentrated on a rotary evaporator at 65° C., with unreacted 1,2-propylenediamine, water and isopropanol being removed. The resulting reaction mixture was a clear, yellowish liquid having an amine number of 523 mg KOH/g.

30 g of this reaction mixture were distilled under reduced pressure at 95° C., and 17.2 g of distillate were collected at a vapor temperature of 64 to 74° C. and 0.028 bar. This gave a colorless liquid having a viscosity of 10.5 mPa·s at 20° C., an amine number of 693 mg KOH/g and a purity as determined by GC of >95% (retention time 8.16-8.21 min), which was used hereinafter as amine 2.

¹H-NMR (CDCl₃): 3.90-3.48 (m, 4H, CH₂—O—CH₂), 2.95 (m, 1H, CHCH₃), 2.75-2.42 (m, 4H, 2×CH₂N), 2.35-1.59 (m, 2H, OCH₂CH₂), 2.02 (m, 1H, CHCH₂N), 1.26 (br s, 3H, NH and NH₂), 1.03 (d, 3H, CH₃).

FT-IR: 3301, 2956, 2925, 2884, 1590, 1452, 1372, 1345, 1129, 1071, 1046, 945, 828.

Production of Hardeners and Epoxy Resin Compositions

For each example, the ingredients specified in table 1 were mixed in the stated quantities (in parts by weight) of the hardener component using a centrifugal mixer (SpeedMixer™ DAC 150, FlackTek Inc.) and the mixtures were stored in the absence of moisture.

Similarly, the ingredients of the resin component as specified in table 1 were processed and stored.

Thereafter the two components of each composition were processed to a homogeneous liquid using the centrifugal mixer, and this liquid was tested immediately as follows:

10 minutes after mixing, the viscosity at 20° C. was ascertained (“viscosity (10′)”).

A first film was drawn down in a film thickness of 500 μm onto a glass plate, which was stored/cured under standard conditions. Determined on this film was the Kö nig hardness (pendulum hardness as König, measured to DIN EN ISO 1522) after 1 day (“Kö nig hardness (1 d SC)”), after 2 days (“Kö nig hardness (2 d SC)”), after 4 days (“Kö nig hardness (4 d SC)”), after 7 days (“Kö nig hardness (7 d SC)”), and after 14 days (“Kö nig hardness (14 d SC)”). After 14 days, the appearance of the film was assessed (identified in the table as “appearance (SC)”. A film identified as “attractive” there was clear and had a glossy and nonsticky surface without structure. “Structure” here refers to any kind of marking or pattern on the surface.

A second film was drawn down onto a glass plate in a film thickness of 500 μm, and this film immediately after application was stored, or cured, at 8° C. and at 80% relative humidity for 7 days and subsequently under standard conditions (SC) for 3 weeks. 24 hours after application, a polypropylene bottle cap was placed onto the film, with a moist sponge placed beneath the cap. After a further 24 hours, the sponge and the cap were removed and were placed on a new site on the film, where, after 24 hours, they were removed again and placed anew, a total of 4 times. Thereafter the appearance of this film was assessed (identified in the tables as “appearance (8°/80%)”), in the same way as described for the appearance (SC). Also reported here in each case is the number of marks visible in the film as a result of the wet sponge and/or the applied cap. On the films cured in this way, the Kö nig hardness was again determined, in each case after 7 days at 8° C. and 80% relative humidity (“Kö nig hardness (7 d 8°/80%)”), then after a further 2 days under SC (“Kö nig hardness (+2 d Sc)”), 7 days under SC (“Kö nig hardness (+7 d SC)”), and 14 d under SC (“Kö nig hardness (+14 d Sc)”).

A further measure used for the yellowing was the color change after exposure in a weathering tester. For this purpose, a further film was drawn down in a film thickness of 500 μm onto a glass plate and was stored, or cured, under standard conditions for 2 weeks and subsequently exposed in a Q-Sun Xenon Xe-1 weathering tester with Q-SUN Daylight-Q optical filter and with a xenon lamp, with a luminous intensity of 0.51 W/m² at 340 nm and at a temperature of 65° C. for 72 hours (Q-Sun (72 h)). Thereafter the color difference ΔE of the film thus exposed was determined in comparison to the corresponding unexposed film, using an NH310 colorimeter from Shenzen 3 NH Technology Co. LTD, equipped with Silicon Photoelectric Diode Detector, Light Source A, Color Space Measurement Interface CIE L*a*b*C*H*. ΔE values of 0.5 to 1.5 here represent a small color difference, 1.5 to 3a marked color difference, 3 to 6a distinctly visible color difference, and more than 6a large color difference.

The results are reported in table 1.

The epoxy resin compositions EZ-1 to EZ-4 are inventive examples. The epoxy resin compositions Ref-1 and Ref-2 are comparative examples.

TABLE 1 Composition and properties of EZ-1 to EZ-4 and Ref-1 to Ref-2. Example EZ-1 EZ-2 EZ-3 EZ-4 Ref-1 Ref-2 NV-2410 NV-2411 NV-2412 NV-2413 NV-2309 NV-2352 Resin component: Araldite ® GY-250 167.2 167.2 167.2 167.2 167.2 167.2 Araldite ® DY-E 31.8 31.8 31.8 31.8 31.8 31.8 Hardener component: Amine 1 1 2 2 — — 56.8 28.4 52.8 26.4 EP adduct 1 — 45.0 — 45.0 — 45.0 Gaskamine ® 240 — — — — 103.0 51.5 Viscosity (10′) [Pa · s] 0.36 1.36 0.34 1.19 0.60 1.66 König hardness [s] (1 d SC) 19 56 9 42 29 43 (2 d SC) 83 119 77 113 77 87 (4 d SC) 143 172 158 165 113 134 (7 d SC) 181 188 176 190 132 148 (14 d SC) 182 202 171 195 143 175 Appearance (SC) attractive attractive attractive attractive attractive attractive Q-Sun (72 h) ΔE 2.5 2.1 1.4 0.9 17.3 5.0 König hardness [s] (7 d 8°/80%) 10 46 n.m. 24 36 14 (+2 d SC) 13 134 n.m. 76 85 119 (+7 d SC) 52 168 n.m. 84 116 157 (+14 d SC) 70 186 n.m. 99 126 176 Appearance (8°/80%) slightly attractive sticky slightly attractive attractive matt matt Number of marks 2 1 n.m. 4 1 1 “n.m.” stands for “not measurable” (sticky) 

The invention claimed is:
 1. A method comprising hardening at least one epoxy resin with a hardener comprising an amine of formula (I),

where: X is 1,2-ethylene or 1,2-propylene, R is a hydrogen radical or is a hydrocarbon radical having 1 to 6 carbon atoms, A is a five-, six- or seven-membered cycloalkyl radical having 4 to 7 carbon atoms and the ring contains an oxygen, sulfur, or nitrogen atom, Y is identical or different radicals selected from the group consisting of alkyl, alkoxy, and dialkylamino having 1 to 18 carbon atoms, and n is 0 or 1 or 2 or
 3. 2. The method as claimed in claim 1, wherein X is 1,2-propylene.
 3. The method as claimed in claim 1, wherein R is a hydrogen radical.
 4. The method as claimed in claim 1, wherein A is a five- or six-membered cycloalkyl radical having 4 to 6 carbon atoms and the ring contains an oxygen atom.
 5. The method as claimed in claim 1, wherein R is a hydrogen radical, and n is
 0. 6. The method as claimed in claim 1, wherein the amine of the formula (I) is obtained from reductive alkylation of 1,2-ethylenediamine or 1,2-propylenediamine with at least one aldehyde or ketone of formula (II) and hydrogen,

where G is A or an unsaturated radical which can be hydrogenated to A.
 7. The method as claimed in claim 6, wherein: 1,2-ethylenediamine or 1,2-propylenediamine is used in a stoichiometric excess over the carbonyl groups, and the excess is removed distillatively after the reduction.
 8. The method as claimed in claim 1, wherein in A, the ring contains an oxygen atom.
 9. A hardener for epoxy resins, comprising at least one amine of formula (I):

where: X is 1,2-ethylene or 1,2-propylene, R is a hydrogen radical or is a hydrocarbon radical having 1 to 6 carbon atoms, A is a five-, six- or seven-membered cycloalkyl radical having 4 to 7 carbon atoms and the ring contains an oxygen, sulfur, or nitrogen atom, Y is identical or different radicals selected from the group consisting of alkyl, alkoxy, and dialkylamino having 1 to 18 carbon atoms, and n is 0 or 1 or 2 or 3, and at least one further amine not corresponding to the formula (I), and/or at least one accelerator, wherein the hardener is a fluid and contains not more than 5 weight % of a diluent, and wherein the further amine is an adduct, containing at least three amine hydrogens, of at least one polyamine having 2 to 12 carbon atoms and at least one epoxide.
 10. The hardener as claimed in claim 9, wherein: the epoxide is an aromatic monoepoxide, and the polyamine and the aromatic monoepoxide are reacted in a molar ratio of approximately 1/1.
 11. The hardener as claimed in claim 9, wherein, based on the reactive constituents, the hardener contains 5 to 65 weight % of the amine of the formula (I).
 12. A method for preparing the hardener for epoxy resins as claimed in claim 9, comprising diluting the at least one further amine not corresponding to the formula (I), and/or the at least one accelerator with the amine of the formula (I).
 13. The hardener as claimed in claim 9, wherein the hardener is diluent-free.
 14. A cured composition obtained from the curing of an epoxy resin composition or of a coating comprising the epoxy resin composition, wherein the epoxy resin composition comprises a resin component comprising at least one epoxy resin and a hardener component comprising at least one amine of formula (I):

where: X is 1,2-ethylene or 1,2-propylene, R is a hydrogen radical or is a hydrocarbon radical having 1 to 6 carbon atoms, A is a five-, six- or seven-membered cycloalkyl radical having 4 to 7 carbon atoms and the ring contains an oxygen, sulfur, or nitrogen atom, Y is identical or different radicals selected from the group consisting of alkyl, alkoxy, and dialkylamino having 1 to 18 carbon atoms, and n is 0 or 1 or 2 or 3, wherein the epoxy resin composition contains not more than 5 weight % of a diluent.
 15. The cured composition as claimed in claim 14 obtained from the curing of the coating comprising the epoxy resin composition.
 16. The cured composition as claimed in claim 14, wherein the hardener component is a fluid. 